Astro Adhesives

The Astro Packaging adhesives specialists team has decades of experience in contract manufacturing, contract packaging, and low temperature assembly. Astro Packaging can handle even the largest secondary packaging projects. Final assembly, club packs, and product postponement strategies are in demand from major grocers and club stores. Performing these functions at the point of production however is often not an option. This gets your finished configuration closer to its destinaton point – and eliminates the need for an additional transportation step. Contact Astro Packaging for your low temperature hot melts requirements. The Total Cost of Hot Melt Dispensing Equipment Maintenance and Replacement Parts are reduced and downtime is dramatically decreased providing for greater production efficiencies.


Do you want to learn about Low Temperature Flip-chip Packaging based on Stencil Printing Technology?
Abstract: The MAT21 project, funded by the British funding agency, EPSRC, aims to integrate microsystems and flip-chip technology into commercial contract high volume electronics manufacturing assembly lines. The technology is based on flip-chip applications and is viewed as a step towards advanced assembly and packaging processes for future MEMS technology markets. The project seeks to deliver commercially viable processes for ultra-fine sub-100μm pitch connections using stencil printing at a length scale of one order magnitude less than presently available. The project consortium of two Universities: Heriot-Watt and Greenwich are engaged in a highly interdisciplinary research program involving microsystems manufacturing, materials science and computational modeling. The consortium is strengthened by the industrial support from leading-edge companies including Celestica, Cookson, Merlin Circuit Technology, DEK Printing Machines, Electronic Technology Services and Micro-Emissive Displays, which cover the whole supply and manufacturing chains in electronics packaging. Significant results reported in this paper include the development of next generation electroformed stencils with repeatable apertures size down to 10μm on a 20μm pitch, and down to a 10μm web. Successful prints of silver filled Isotropic Conductive Adhesive (ICA) was printed down to 50μm pitch with consistent printing demonstrated at 90μm pitch. The performance of the micro-engineered stencil in terms of fluid flow dynamics during the deposition of the bonding material was developed using multi-physics simulation and modeling. Rheological tests of the rolling of the paste were also carried out. Current and developed computational models were used to predict the reliability of such microsystem assembly processes with the underfill characteristics aiding in identifying possible process weaknesses. An end user prototype chip was assembled to prove the feasibility of the developed packaging process. Click here to view the full Article PDF


A more Recent development in packaging adhesives is the use of Low Temperature Hot Melts which are applied at 250°F instead of 350°F.  Low Temperature Packaging Hot Melts provide the same Bonding performance for most Packaging Applications. They are:
  • Safer to use
  • Easier to clean up
  • Lower operating costs
  • Cleaner machining
  • Multi-Packs
  • Rainbow Packs
  • Pallet Displays
  • Overwrapping / Bundling
  • Club Packs and more…


These manufactures carry fugitive glue product lines:
  • Astro Packaging
  • H.B. Fuller
  • Henkel
  • Bostik
  • Jowat
  • Forbo Swift